QA Nd-Yag 50W Laser scribing /cutting/ edge /deleting system

Comprehensive functions Simple operation Long term stability Long workable time High precision and good scribing quality

Brief IntroductionAccording to the requirement of photovoltaic industry development, our company develops a new series of laser scribing machines, which can be widely used to scribe polycrystalline and mono crystalline silicon wafer, non-crystalline silicon solar cell, and to scribe and cut other substrate material of semiconductors such as silicon, Ge, GaAs Material and so on.

Configuration

Nd-YAG laser system Sound-optical modular Numerical controlled X,Y working table Vacuum adsorbing system Step motor drive controlled by computer

AdvantageThe system of the machine is developed with international prevalent modularization design and its key components are all imported high-quality ones. It has gained customers’ acknowledgement and authorization.• It has the very good performance of high scribing speed • High precision • Comprehensive functions • Simple operation • Long workable time • Long term stability

Specifications

Wavelength 1.064 µm Precision ≤ ± 1 µm Max scribing depth 1,2mm Min width of line 50 µm Laser repetition frequency Adjustable between 200HZ and 50KHZ Max scribing speed 140mm/s(8, 4 m/min.) Max power of laser ≥ 50W Dimensions 65mm × 550mm × 750mm Working table dimension 350mm × 350mm Power supply 380 V (220V)/50 Hz/5 kVA

Production efficiency

Level	2	3	4	8	16	22
Scribing speed	80~100 mm/s
EfficiencyPiece/min	9-12	8-9	4-6	2.5-4	1.5-2	0.8-1
Date Yield	16-20kW	16-20kW	8-9kW	5.5kW	3-3.5kW	1.5-2kW
Year YieldMW/Year	4-4.8	3-4.3	2-2.3	1.3	0.8	4.5
Remark	1. 10 hours/per day, 250 days/per year.2. 125mm 2.3W , 156mm 3.6W

Samples

QA Nd-Yag 50W Laser scribing /cutting/ edge /deleting system